Abubakar Hassan
Department of Computer Engineering, University of Maiduguri, Maiduguri, P.M.B 1069, Nigeria
*Corresponding author’s Email: abubakarhassan@unimaid.edu.ng, doi.org/10.55639/607.414039
ABSTRACT
Modern mobile cyber-physical systems such as hand-held smartphones, tablets and wearable devices are now key part of human daily lives. People increasingly rely on these devices to perform many daily tasks such as monitoring smart appliances, watching favourite TV series, playing favourite video games, and tracking social and active lives. Majority of today’s mobile computing devices increasingly employ Multi-Processor System-on-chip (MPSoC), which consists of many processing cores integrated on a single chip. These mobile devices are battery operated at all the times. As a result, they have limited power supply and their reliability in terms of life span is also impaired by the peak thermal behaviour that also makes them susceptible to temperature side-channel attack. In this research paper, we review the existing thermal and energy efficiency management methodologies in mobile MPSoC devices. The merits and limitations of these methodologies are discussed, and future research direction highlighted. It is found that most of the methodologies enhances either energy efficiency or thermal behaviour in mobile devices. In addition, they employ frequency scaling and thread partitioning and mapping to these objectives. However, these approaches have not considered dynamic computing resources managements in enhancing thermal and energy efficiency. Therefore, there need is to improve thermal and energy efficiency through intelligent resource management in mobile and embedded computing systems for better user experience and device reliability.
Keywords:
Thermal Management,
Energy Efficiency,
MPSoC,
Mobile Cyber-physical
Systems